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1/8 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. s t epping mot o r driver series high v o lt age series s t epping motor drivers bd6422efv ( p arallel-in type) bd6425, bd6423ef v (clk-in type) desc ri ptio n these products are a low power consumpti on pwm constant current-drive driver of bipolar stepping motor with power supplys rated voltage of 45v and rate d output current of 1.0a, 1.5a. f e atu r e 1) power supply: one system drive (rated voltage of 45v) 2) rated output current: 1.0a, 1.5a 3) low on resistance dmos output 4) clk-in drive mode (bd6425/6423efv) 5) parallel in drive mode (bd6422efv) 6) pwm constant current c ontrol (other oscillation) 7) built-in spike noise blanking function (external noise filter is unnecessary) 8) full step & half step (two kinds), applicable to quarter step 9) current decay mode switching function (4 kinds of fast/slow decay ratio) 10) normal rotation & reverse rotation switching function (bd6425/6423efv) 11) power save function 12) built-in logic input pull-down resistor 13) power-on reset function(bd6425/6423efv) 14) thermal shutdown circuit (tsd) 15) over current protection circuit (ocp) 16) under voltage lock out circuit (uvlo) 17) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 18) electrostatic discharge: 8kv (hbm specification) 19) microminiature, ultra-thin and high heat-radiation (exposed metal type) htssop package a p p lic ati on serial dot impact printer ? sewing machine etc. absolute maximum ratings(ta=25 ) item symbol bd6425efv bd6423/6422efv unit supply voltage v cc1,2 -0.2 +45.0 -0.2 +45.0 v power dissipation pd 1.45 1 1.1 3 w 4.70 2 4.0 4 w input voltage for control pin v in -0.2 +5.5 -0.2 +5.5 v rnf maximum voltage v rnf 0.7 0.7 v maximum output current i out 1.5 5 1.0 5 a/phase operating temperature range t opr -25 +85 -25 +85 storage temperature range t stg -55 +150 -55 +150 junction temperature t jmax +150 +150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 11.6mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 37.6mw/ for operating above ta=25 . 3 70mm 70mm 1.6mm glass epoxy board. derating in done at 8.8mw/ for operating above ta=25 . 4 4-layer recommended board. derating in done at 32.0mw/ for operating above ta=25 . 5 do not, however exceed pd, aso and tjmax=150 . no.12009eat06 downloaded from: http:///
technical note 2/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. o per ati ng c o n d i tio n s( ( t a = -2 5 +8 5 ) item symbol bd6425efv bd6423/6422efv unit supply voltage v cc1,2 19~42 v maximum output current (dc) i out 1.2 6 0.7 6 a/phase 6 do not however exceed pd, aso. e l ectr ic al c h a r act e rist ics (un l ess ot her w i se sp ecif ie d t a = 2 5 ? v cc1 ,2 =3 7v) item symbol limit unit condition min. typ. max. w h ol e circuit current at standby i ccst - 1.0 2.5 ma ps=l circuit current i cc - 2.0 5.0 ma ps=h, vref=3v c o ntrol in put h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v h level input current i inh 35 50 100 av in =5v l level input current i inl -10 0 - av in =0v out put (out 1a, out 1 b, out 2 a, o u t 2 b) output on resistance(bd6425efv) r on - 1.10 1.43 i out =1.0a,sum of upper and lower output on resistance(bd6423/6422efv) r on - 2.00 2.60 i out =0.5a,sum of upper and lower output leak current i leak - - 10 a c u rr ent c ontr o l rnfxs input current (bd6425efv) i rnfs -2.0 -0.1 - a rnfxs=0v rnfx input current i rnf -40 -20 - a rnfx=0v vref input current i vref -2.0 -0.1 - avref=0v vref input voltage range v ref 0 - 3.0 v minimum on time (blank time) t onmin 0.5 1.5 3.0 s c=470pf, r=82k bd6425/6423efv comparator threshold v cth 0.57 0.60 0.63 v vref=3v bd6422efv comparator threshold 100% v cth100 0.57 0.60 0.63 v vref=3v, (i0x,i1x)=(l,l) comparator threshold 67% v cth67 0.38 0.40 0.42 v vref=3v, (i0x,i1x)=(h,l) comparator threshold 33% v cth33 0.18 0.20 0.22 v vref=3v, (i0x,i1x)=(l,h) downloaded from: http:///
technical note 3/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. terminal function and application circuit diagram 1) bd6425efv pin no. pin name function pin no. pin name function 1 gnd ground terminal 15 clk clock input terminal for advancing the electrical angle. 2 out1b h bridge output terminal 16 cw_ccw motor rotating direction setting terminal 3 rnf1 connection terminal of resistor for output current detection 17 test terminal for testing (used by connecting with gnd) 4 rnf1s input terminal of current limit comparator 18 mode0 motor excitation mode setting terminal 5 out1a h bridge output terminal 19 mode1 motor excitation mode setting terminal 6 nc non connection 20 enable power supply terminal 7 vcc1 power supply terminal 21 nc non connection 8 nc non connection 22 vcc2 power supply terminal 9 gnd ground terminal 23 nc non connection 10 cr connection terminal of cr for setting chopping frequency 24 out2a h bridge output terminal 11 dec1 current decay mode setting terminal 25 rnf2s input terminal of current limit comparator 12 dec2 current decay mode setting terminal 26 rnf2 connection terminal of resistor for output current detection 13 vref output current value setting terminal 27 out2b h bridge output terminal 14 ps power save terminal 28 nc non connection fig.1 block diagram & application circuit diagram of bd6425efv 0.3 predriver 7 vcc1 blank time pwm control translator 2bit dac tsd uvlo regulator reset 9 gnd 10 cr 12 dec2 14 ps 15 clk 18 mode0 19 mode1 11 dec1 16 cw_ccw 20 enable vref 13 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1 gnd 27 out2b 26 rnf2 17 test control logic mix decay control rnf1 rnf2 ocp osc 0.3 terminal for testing. please connect to gnd. 82k 470pf set the chopping frequency. setting range is c:330pf 1500pf r:15k ? 200k bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) be sure to short vcc1 & vcc2. resistor for current. detecting. setting range is 0.2 ? 0.4 . 100uf logic input terminal. set the output currenet. input by resistor divison. logic input terminal. for setting current decay mode power save terminal. 4 rnf1s 25 rnf1s 0.1uf resistor for current. detecting. setting range is 0.2 ? 0.4 . downloaded from: http:///
technical note 4/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. 2) bd6423efv pin no. pin name function pin no. pin name function 1 gnd ground terminal 13 clk clock input terminal for advancing the electrical angle. 2 out1b h bridge output terminal 14 cw_ccw motor rotating direction setting terminal 3 rnf1 connection terminal of resistor for output current detection 15 test terminal for testing (used by connecting with gnd) 4 out1a h bridge output terminal 16 mode0 motor excitation mode setting terminal 5 vcc1 power supply terminal 17 mode1 motor excitation mode setting terminal 6 nc non connection 18 enable output enable terminal 7 gnd ground terminal 19 nc non connection 8 cr connection terminal of cr for setting pwm frequency 20 vcc2 power supply terminal 9 dec1 current decay mode setting terminal 21 out2a h bridge output terminal 10 dec2 current decay mode setting terminal 22 rnf2 connection terminal of resistor for output current detection 11 vref output current value setting terminal 23 out2b h bridge output terminal 12 ps power save terminal 24 nc non connection fig.2 block diagram & application circuit diagram of bd6423efv 0.5 predriver 5 vcc1 blank time pwm control translator 2bit dac tsd uvlo regulator reset 7 gnd 8 c r 10 dec2 12 ps 13 cl k 16 mode0 17 mode1 9 dec1 14 cw_ccw 18 enable vref 11 2 out1b 4 out1a 3 rnf1 20 vcc2 21 out2a 1 gnd 23 out2b 22 rnf2 15 test control logic mix decay control rnf1 rnf2 ocp osc 0.5 terminal for testing. please connect to gnd. resistor for current. detecting. setting range is 0.4 ? 0.8 . 82k 470pf set the pwm frequency. setting range is c:330pf 1500pf r:15k ? 200k bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) be sure to short vcc1 & vcc2. resistor for current. detecting. setting range is 0.4 ? 0.8 . 100uf logic input terminal setting output current input by resistance division. logic input terminal for setting current decay mode power save terminal. 0.1uf downloaded from: http:///
technical note 5/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. 3) bd6422efv pin no. pin name function pin no. pin name function 1 gnd ground terminal 13 phase1 phase selection terminal 2 out1b h bridge output terminal 14 i01 vref division ratio setting terminal 3 rnf1 connection terminal of resistor for output current detection 15 i11 vref division ratio setting terminal 4 out1a h bridge output terminal 16 phase2 phase selection terminal 5 vcc1 power supply terminal 17 i02 vref division ratio setting terminal 6 nc non connection 18 i12 vref division ratio setting terminal 7 gnd ground terminal 19 nc non connection 8 cr connection terminal of cr for setting pwm fr eque n cy 20 vcc2 power supply terminal 9 dec1 current decay mode setting terminal 21 out2a h bridge output terminal 10 dec2 current decay mode setting terminal 22 rnf2 connection terminal of resistor for output current detection 11 vref output current value setting terminal 23 out2b h bridge output terminal 12 ps power save terminal 24 nc non connection fig.3 block diagram & application circuit diagram of bd6422efv predriver 5 vcc1 blank time pwm control 2bit dac tsd uvlo regulator 7 gnd 8 c r 10 dec2 12 ps 13 phase1 16 phase2 14 i01 9 dec1 15 i11 17 i02 vref 11 2 out1b 4 out1a 3 rnf1 20 vcc2 21 out2a 1 gnd 23 out2b 22 rnf2 control logic mix decay control rnf1 rnf2 ocp osc 0.5 0.5 100uf 0.1uf resistor for current. detecting. setting range is 0.4 ? 0.8 . 82k 470pf set the pwm frequency. setting range is c:330pf 1500pf r:15k ? 200k bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) be sure to short vcc1 & vcc2. resistor for current. detecting. setting range is 0.4 ? 1.0 . i12 18 logic input terminal. setting output current. input by resistance division. logic input terminal. for setting current decay mode power save terminal. downloaded from: http:///
technical note 6/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. usage notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply li nes of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) metal on the backside (define the side w here product markings are printed as front) the metal on the backside is shorted with the backside of ic ch ip therefore it should be connec ted to gnd. be aware that there is a possibility of malfunction or destruction if it is shorted wi th any potential other than gnd. (6) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. users should be aware that these produc ts have been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in th is area to improve dissipation. as large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface. it is important to consider actual usage conditions and to take as large a dissipation pattern as possible. (7) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. (8) operation in a strong electric field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (9) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (10) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit). if the chip te mperature becomes tjmax=150 , and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (11) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. downloaded from: http:///
technical note 7/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. (12) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each elements n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 4, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ics structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. fig. 4 pattern diagram of parasitic element (13) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. (14) test terminal (bd6425/6423efv) be sure to connect test pin to gnd. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element downloaded from: http:///
technical note 8/8 bd6422efv , bd 6423efv , bd 6425efv www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. or der in g p a rt n u mb er b d 6 4 2 2 e f v - e 2 ?` efv=htssop-b24(bd6423efv /bd6422efv) efv=htssop-b28(bd6425efv) ?`?? e2: `???` (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 4 s 24 13 11 2 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) htssop-b28 0.08 m 0.08 s s 1.0 0.2 0.5 0.15 4 + 6 4 0.17 +0.05 - 0.03 15 28 14 1 (2.9) 4.4 0.1 (5.5) (max 10.05 include burr) 0.625 6.4 0.2 9.7 0.1 1pin mark 1.0max 0.65 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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